Ceramic Interconnect Technology Handbook

Author: Fred D. Barlow, III
Editor: CRC Press
ISBN: 1420018965
File Size: 23,50 MB
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Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.

Multichip Module Technology Handbook

Author: Philip E. Garrou
Editor: McGraw-Hill Professional Publishing
ISBN:
File Size: 51,73 MB
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Multichip Modules (MCMs) are increasingly in the mainstream of electronics design due to both their falling prices and increasing demands for speed and performance. Endorsed by the International Microelectronics and Packaging Society (IMAPS), this handbook will serve as the standard MCM reference for the electronics industry. It provides complete guidance on how to design, manufacture, assemble, test, and inspect the MCMs of today and tomorrow. Focus on application of MCMs to industry design problems accompanies analysis of the pros and cons of ceramic, deposited, and laminate MCMs. Other key topics include tech drivers--MCM electrical performance--large area processing--3D packaging--module-to-board interconnection--high clock rate systems--known good die (KGD)--and thermal issues.

Microwave Materials And Applications

Author: Mailadil T. Sebastian
Editor: John Wiley & Sons
ISBN: 1119208564
File Size: 60,89 MB
Format: PDF
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The recent rapid progress in wireless telecommunication, including the Internet of Things, 5th generation wireless systems, satellite broadcasting, and intelligent transport systems has increased the need for low-loss dielectric materials and modern fabrication techniques. These materials have excellent electrical, dielectric, and thermal properties and have enormous potential, especially in wireless communication, flexible electronics, and printed electronics. Microwave Materials and Applications discusses the methods commonly employed for measuring microwave dielectric properties, the various attempts reported to solve problems of materials chemistry and crystal structure, doping, substitution, and composite formation, highlighting the processing techniques, morphology influences, and applications of microwave materials whilst summarizing many of the recent technical research accomplishments in the area of microwave dielectrics and applications Chapters examine: Oxide ceramics for dielectric resonators and substrates HTCC, LTCC and ULTCC tapes for substrates Polymer ceramic composites for printed circuit boards Elastomer-ceramic composites for flexible electronics Dielectric inks EMI shielding materials Microwave ferrites A comprehensive Appendix presents the fundamental properties for more than 4000 low-loss dielectric ceramics, their composition, crystal structure, and their microwave dielectric properties. Microwave Materials and Applications presents a comprehensive view of all aspects of microwave materials and applications, making it useful for scientists, industrialists, engineers, and students working on current and emerging applications of wireless communications and consumer electronics.

Microwave Materials And Applications 2 Volume Set

Author: Mailadil T. Sebastian
Editor: John Wiley & Sons
ISBN: 1119208521
File Size: 51,29 MB
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12.2.2 Composite Preparation

Rheology

Author: Juan De Vicente
Editor: BoD – Books on Demand
ISBN: 9535101870
File Size: 42,36 MB
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This book contains a wealth of useful information on current rheology research. By covering a broad variety of rheology-related topics, this e-book is addressed to a wide spectrum of academic and applied researchers and scientists but it could also prove useful to industry specialists. The subject areas include, polymer gels, food rheology, drilling fluids and liquid crystals among others.

Applications Of Electrochemistry In Medicine

Author: Mordechay Schlesinger
Editor: Springer Science & Business Media
ISBN: 1461461480
File Size: 33,99 MB
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Medical Applications of Electrochemistry, a volume of the series Modern Aspects of Electrochemistry, illustrates the interdisciplinary nature of modern science by indicating the many current issues in medicine that are susceptible to solution by electrochemical methods. This book also suggests how personalized medicine can develop.

The Vlsi Handbook

Author: Wai-Kai Chen
Editor: CRC Press
ISBN: 1420005960
File Size: 28,74 MB
Format: PDF, Kindle
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For the new millenium, Wai-Kai Chen introduced a monumental reference for the design, analysis, and prediction of VLSI circuits: The VLSI Handbook. Still a valuable tool for dealing with the most dynamic field in engineering, this second edition includes 13 sections comprising nearly 100 chapters focused on the key concepts, models, and equations. Written by a stellar international panel of expert contributors, this handbook is a reliable, comprehensive resource for real answers to practical problems. It emphasizes fundamental theory underlying professional applications and also reflects key areas of industrial and research focus. WHAT'S IN THE SECOND EDITION? Sections on... Low-power electronics and design VLSI signal processing Chapters on... CMOS fabrication Content-addressable memory Compound semiconductor RF circuits High-speed circuit design principles SiGe HBT technology Bipolar junction transistor amplifiers Performance modeling and analysis using SystemC Design languages, expanded from two chapters to twelve Testing of digital systems Structured for convenient navigation and loaded with practical solutions, The VLSI Handbook, Second Edition remains the first choice for answers to the problems and challenges faced daily in engineering practice.

Tms 2015 144th Annual Meeting Exhibition Annual Meeting Supplemental Proceedings

Author: The Minerals, Metals & Materials Society (TMS)
Editor: Springer
ISBN: 3319481274
File Size: 48,28 MB
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The Handbook Of Advanced Materials

Author:
Editor: John Wiley & Sons
ISBN: 9780471465171
File Size: 40,26 MB
Format: PDF, Mobi
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Written to educate readers about recent advances in the area of newmaterials used in making products. Materials and their propertiesusually limit the component designer. * Presents information about all of these advanced materials thatenable products to be designed in a new way * Provides a cost effective way for the design engineer to becomeacquainted with new materials * The material expert benefits by being aware of the latestdevelopment in all these areas so he/she can focus on furtherimprovements

Integrated Circuit Packaging Assembly And Interconnections

Author: William Greig
Editor: Springer Science & Business Media
ISBN: 0387339132
File Size: 51,49 MB
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Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.

Area Array Interconnection Handbook

Author: Karl J. Puttlitz
Editor: Springer Science & Business Media
ISBN: 9780792379195
File Size: 72,66 MB
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This handbook provides a comprehensive treatment of area-array interconnections for both chips and microelectronic packages in terms of optimizing densification, functionality and reliability. It provides comparisons with alternative and competing technologies, clearly defining cost versus benefit tradeoffs and strategies. Process details are defined in the order of their typical manufacturing sequence, indicating tooling requirements and potential yield detractors. In addition, the handbook has individual chapters devoted to supporting disciplines that play a key role in satisfying the requirements of microelectronic package applications: efficient thermal-dissipation techniques, metallurgical and mechanical characteristics of interconnections and electrical design strategies. Area-array technology at both die and chip carrier levels offers the best opportunity of satisfying the demanding performance requirements that users at all levels of the product spectrum have come to expect. This handbook fully describes the `how and why' of the inherent elements of area-array technology that give rise to enhanced electrical and thermal dissipation capabilities, and densification to accommodate demanding design requirements, while at the same time accommodating size and cost reductions to enhance comfort and portability. This handbook is the only book that provides a complete and integrated treatment which includes all the aspects of area-array microelectronics. Each chapter is self contained, written in a clear, concise, easy-to-understand manner. It sets forth fundamentals followed by the application of those principles making prior knowledge of the subject material unnecessary in order to utilize this reference. The handbook will serve as an excellent text or companion reference for a variety of electronic packaging courses or workshops. FEATURES: describes all the key elements of microelectronic packaging technology; organized into three categories: die, chip carrier, and support technologies; presents information in a clear and concise manner; can be utilized as a textbook or companion reference for a range of microelectronic packaging courses; each chapter is self-contained; provides guidelines and strategies for making microelectronic packaging choices. ABOUT THE EDITORS: Considered `pioneers' in the field of microelectronics packaging, Karl Puttlitz and Paul Totta represent 80 years of experience in all aspects of the technology. They were key forces in the definition and implementation of flip-chip technology from its very inception at IBM and through its evolution during the past four decades. As major contributors in the development and manufacture of various microelectronics chip-carrier packages, the authors are frequently invited to speak at universities, international conferences and workshops.

Handbook Of Ceramics Glasses And Diamonds

Author: Charles A. Harper
Editor: McGraw Hill Professional
ISBN: 9780071414678
File Size: 16,70 MB
Format: PDF, Kindle
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Materials design, prototyping, and manufacturing resource The be-all, end-all resource for product designers and industry specialists, Handbook of Ceramics, Glasses and Diamonds tells you how to get optimal performance from these materials. The Handbook is packed with materials properties, processes and requirements data. You get selection and design guidelines and valuable application insights, plus three chapters devoted exclusively to diamond technology. Written by leading materials expert Charles Harper, the Handbook brings you up to speed on cutting-edge ceramics, glasses and diamonds and their use innovative use in new products, including: * Electronic ceramics and advanced ceramics/composites * Advanced applications of glasses * Process and properties of CVD diamonds * Industrial diamonds and diamond technology applications

Copper Interconnect Technology

Author: Tapan Gupta
Editor: Springer Science & Business Media
ISBN: 9781441900760
File Size: 17,82 MB
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Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.

American Book Publishing Record

Author:
Editor:
ISBN:
File Size: 51,49 MB
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Hybrid Microcircuit Technology Handbook

Author: James J. Licari
Editor: William Andrew
ISBN:
File Size: 74,81 MB
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Handbook integrating the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid circuits emphasizing those technology segments crucial to the success of producing reliable circuits in high yields. Annotation copyrighted by Book News, Inc., Portland, OR

Hybrid Microcircuit Technology Handbook 2nd Edition

Author: James J. Licari
Editor: Elsevier
ISBN: 081551798X
File Size: 29,57 MB
Format: PDF, ePub
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The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.

Microelectronics Packaging Handbook

Author: R.R. Tummala
Editor: Springer Science & Business Media
ISBN: 1461540860
File Size: 24,82 MB
Format: PDF, Kindle
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Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Microelectronics Packaging Handbook

Author: Rao Tummala
Editor: Springer Science & Business Media
ISBN: 9780412084416
File Size: 31,43 MB
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This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Handbook Of Semiconductor Manufacturing Technology

Author: Yoshio Nishi
Editor: CRC Press
ISBN: 1420017667
File Size: 26,23 MB
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Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Handbook Of Optical Interconnects

Author: Shigeru Kawai
Editor: CRC Press
ISBN: 1351836854
File Size: 26,38 MB
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As we reach the data transmission limits of copper wire and communications experts seek to bring the speed of long-haul fiber optics networks closer to access points, optical interconnects promise to provide efficient, high-speed data transmission for the next generation of networks and systems. They offer higher bit-rates, virtually no crosstalk, lower demands on power requirements and thermal management, and the possibility of two-dimensional channel arrays for chip-to-chip communication. The Handbook of Optical Interconnects introduces the systems and devices that will bring the speed and quality of optical transmission closer to the circuit board. Contributed by active experts, most from leading technology companies in the US and Japan, this outstanding handbook details various low-cost and small-size configurations, illustrates the discussion with more than 300 figures, and offers a look at the applications and future of this exciting and rapidly growing field. The book includes a detailed introduction to vertical cavity surface-emitting lasers (VCSELs); the use of optical interconnects in metropolitan, local-area, and access networks through FTTP (FTTH); and Jisso technologies, which are critical for developing low-cost, small-size modules. Driving down the size and cost of optical interconnects is vital for integrating these technologies into the network and onto microprocessors, and the Handbook of Optical Interconnects provides the knowledge and tools necessary to accomplish these goals.